Repeater Node - Heat Testing v2

Since PA3, the team has been inducted to use high risk ABS 3D printers in the ANU maker space. This has allowed us to print a prototype repeater case from ABS fillament - rather than PLA. ABS has much greater heat resistance than PLA because of its higher glass transition temperature, which is around 105∘C compared to PLA's 60∘C.

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We tested this improved heat resistance using the same method as for the PLA case. It was placed in an oven at round 70C for approximately 2 hours and warping/degradation results were recorded

Results were very successful. No warping/lifting was observed at all - the case maintained it's seal. It's likely this repeater will be sent to Lismore SES for operational deployment.